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Alfalume samples 1.3μm high-power uncooled InAs/GaAs QD DFB lasers
News: Optoelectronics 6 March 2023 In partnership with quantum dot (QD) diode laser manufacturer Innolume GmbH of Dortmund, Germany, Alfalume Inc of Santa Clara, CA, USA has announced sample...
View ArticleExploring the Role of Semiconductors in Mobile Communications: Examining 5G...
The role of semiconductors in mobile communications is essential to the development of modern technology. From the early days of analog cellular networks to the current 5G networks, semiconductors have...
View ArticleNetwork-on-Chip Architectures with Physical Awareness
Network-on-Chip (NoC) architectures are becoming increasingly popular in modern computing systems. This is because they offer a high degree of scalability and flexibility, allowing for the efficient...
View ArticleDesign of Physically Aware Network-on-Chip Architectures
Network-on-Chip (NoC) architectures are becoming increasingly important in the design of modern computer systems. They are used to connect multiple processing elements, such as CPUs, GPUs, and FPGAs,...
View ArticleNick Singh Appointed as Chief Technology Officer of CSA Catapult
On April 15th, 2020, Nick Singh was appointed as the Chief Technology Officer (CTO) of CSA Catapult, a leading provider of advanced analytics and artificial intelligence (AI) solutions. Singh brings...
View ArticleNick Singh Named CTO of CSA Catapult
On February 1st, CSA Catapult announced the appointment of Nick Singh as their new Chief Technology Officer (CTO). Nick Singh brings with him a wealth of experience in the technology industry, having...
View ArticleAdvanced Materials and Technologies for EUV Sculpta Braggadocio Rollout: A...
The European Union (EU) is on the brink of a technological revolution with the rollout of Extreme Ultraviolet (EUV) Sculpta Braggadocio. This advanced technology is expected to revolutionize the way we...
View ArticleAdvanced Materials and Technologies for the Next 15 Years of Extreme...
The future of Extreme Ultraviolet (EUV) Sculpta Braggadocio Rollout is an exciting prospect for the next 15 years. EUV technology has the potential to revolutionize the way we manufacture products,...
View ArticleAMAT’s “Sculpta” Braggadocio Rollout: A Look at the Next 15 Years of EUV...
The semiconductor industry is always on the lookout for the latest and greatest in technology to stay ahead of the competition. One of the most exciting developments in recent years has been the...
View ArticleAdvanced Materials and Technologies for EUV Sculpta Braggadocio Rollout in...
Photonics West The use of advanced materials and technologies for extreme ultraviolet (EUV) sculpta braggadocio rollout in the next 15 years is an exciting prospect for the future of photonics. EUV...
View ArticleAdvanced Materials and Technologies for EUV Sculpta Braggadocio Rollout: An...
The European Union (EU) is making great strides in the field of advanced materials and technologies for extreme ultraviolet (EUV) sculpta braggadocio rollout. This technology has the potential to...
View ArticleAdvanced Materials and Technologies for EUV Lithography: 15-Year Outlook and...
The European Union (EU) is at the forefront of advanced materials and technologies for extreme ultraviolet (EUV) lithography, a key technology for the production of semiconductor chips. In the past 15...
View ArticleAMAT “Sculpta” Braggadocio Rollout: A Look at the Next 15 Years of EUV...
The world of semiconductor technology is constantly evolving, and the introduction of extreme ultraviolet (EUV) lithography is no exception. In recent years, the semiconductor industry has seen a rapid...
View ArticleAMAT’s “Sculpta” Braggadocio Rollout: A Look at the Next 15 Years of EUV...
The world of semiconductor technology is constantly evolving, and one of the most exciting developments in recent years has been the emergence of extreme ultraviolet (EUV) lithography. This technology...
View ArticleAdvanced Materials and Technologies for EUV’s Next 15 Years: AMAT’s “Sculpta”...
The European Union of Vectors (EUV) is a leading research and development organization dedicated to advancing materials and technologies for the next 15 years. In its mission to create a better future,...
View ArticleAdvanced Materials and Technologies: A Look Ahead at the Next 15 Years of...
The world of advanced materials and technologies is constantly evolving, and the next 15 years are sure to bring exciting new developments. One of the most promising technologies on the horizon is...
View ArticleAdvanced Manufacturing and Automation Technology (AMAT) “Sculpta” Braggadocio...
The future of advanced manufacturing and automation technology (AMAT) is here. The Sculpta Braggadocio rollout is a major step forward in the development of extreme ultraviolet (EUV) technology. This...
View ArticleAdvanced Materials and Technologies: 15-Year Outlook for Extreme Ultraviolet...
The future of advanced materials and technologies is an exciting prospect, and the rollout of Extreme Ultraviolet (EUV) Sculpta Braggadocio by Applied Materials is a major step forward. EUV Sculpta...
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CSA Catapult appoints Nick Singh as CTO
News: Suppliers 6 March 2023 Compound Semiconductor Applications (CSA) Catapult (headquartered in Newport, South Wales) has appointed Nick Singh as its new chief technology officer (CTO). Singh will...
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Tiempo Secure announces TESIC RISC-V Secure Element IP and development…
Tiempo Secure Mikael Dubreucq, Tiempo Secure VP Global Sales and Marketing, says: “By introducing the Tiempo Secure TESIC RISC-V Secure Element IP and its Dev Kit, we are bringing new security...
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SiC power device market to grow 41.4% to $2.28bn in 2023
News: Markets 9 March 2023 According to its latest survey of the market for compound semiconductors, market research firm TrendForce projects that the global market for silicon carbide (SiC) power...
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FPGAs: Automated Framework For Architecture-Space Exploration of Approximate...
A technical paper titled “autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems” was published (preprint) by researchers at TU Wien, Brno...
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More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images...
A technical paper titled “SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering” was published (preprint) by researchers at imec, University of Ulsan, and KU...
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Aixtron maintains annual revenue and earnings growth despite shipment...
News: Suppliers 13 March 2023 For fourth-quarter 2022, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has reported revenue of €183.2m, up slightly (by 1%) from the strong...
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Pasternack Releases High-Voltage 10kV/20kV Connectors and Adapters
Pasternack’s new 10kV/20kV connectors and adapters address high-voltage applications. “Our customers can enjoy access to a broad portfolio of 10kV/20kV connectors and adapters that feature recessed...
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Sino Semicap Sanction Screws Snugged- SVB- Aftermath more important than event
-Reports of further tightening of China SemiCap Restrictions-Likely closing loopholes & pushing back technology line-Dutch have joined, Japan will too- So far no Chinese reaction-SVB is toast but...
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Accellera Update at DVCon 2023
I have a new-found respect for Lu Dai. He is a senior director of engineering at Qualcomm, with valuable insight into the ground realities of verification in a big semiconductor company. He is on the...
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Must-attend webinar event: How better collaboration can improve your yield
In today’s rapidly evolving semiconductor industry, the demand for high-quality and reliable semiconductors at a reasonable cost is increasing. This is why world-class yield management has become more...
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CTO Interview: Dr. Zakir Hussain Syed of Infinisim
Threads XFMvcEntityArrayCollection Object ( [entities:protected] => Array ( [17634] => ThemeHouseXPressXFEntityThread Object ( [_uniqueEntityId:XFMvcEntityEntity:private] => 51...
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Evaluation of the Thermomechanical Reliability of Electronic Packages Using...
A new technical paper titled “Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies”...
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Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle
A new technical paper titled “Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology” was published by researchers at University of Ottawa, Sungkyunkwan University, and...
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Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of...
A technical paper titled “Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED” was published by researchers at Tohoku University in...
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ProTek Devices Intros High Voltage Suppression Component for Aerospace…
ProTek Devices’ SM100KWE78CA, a high-powered surface mount transient voltage suppression component It permits a bidirectional configuration and easy mounting to a printed circuit board. The minimum...
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Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven...
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Power Semiconductor Maker E-tronic Secures Series A+ Financing
E-tronic, a provider of power semiconductors and system solutions for electric vehicles, has recently announced the completion of its series A+ financing round raising tens of millions of yuan. The...
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ams OSRAM adds OSLON UV 3535 series to mid-power UV-C LED range
News: LEDs 22 March 2023 ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has introduced the OSLON UV 3535 series of mid-power UV-C LEDs, meeting customers’ requirements for longer lifetime,...
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ROHM’s ultra-high-speed control IC technology maximizes performance of GaN...
News: Microelectronics 23 March 2023 Due to their superior high-speed switching characteristics the adoption of GaN devices has expanded in recent years. However, the speed of control ICs (for...
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Siemens Keynote Stresses Global Priorities
Dirk Didascalou, Siemens CTO, gave a keynote at DVCon, raising our perspective on why we do what we do. Yes, our work in semiconductor design enables the cloud and 5G and smart everything, but these...
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Power Delivery Network Analysis in DRAM Design
My IC design career started out with DRAM design back in 1978, so I’ve kept an eye on the developments in this area of memory design to note the design challenges, process updates and innovations along...
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Chip Industry’s Technical Paper Roundup: Mar. 28
Industry Research GAAFETs; thermal simulation in 3DIC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs;...
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Research Bits: March 28
Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and...
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Speculation for Simulation. Innovation in Verification
This is an interesting idea, using hardware-supported speculative parallelism to accelerate simulation, with a twist requiring custom hardware. Paul Cunningham (Senior VP/GM, Verification at Cadence),...
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The Rise of the Chiplet
The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a...
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Enable predictive maintenance for line of business users with Amazon Lookout...
Predictive maintenance is a data-driven maintenance strategy for monitoring industrial assets in order to detect anomalies in equipment operations and health that could lead to equipment failures....
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Squeezing The Margins
Systems & Design OPINION Monitoring systems and quickly adjusting clock frequencies improves performance for specific applications and operating environments. Back in 2016, we looked at the...
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Options Widen For Optimizing IoT Designs
Creating a successful IoT design requires a deep understanding of the use cases, and a long list of tradeoffs among various components and technologies to provide the best solution at the right price...
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Wolfspeed’s Durham HQ hosts first stop on Biden’s ‘Invest in America’ tour
News: Microelectronics 29 March 2023 At its headquarters in Durham, NC, USA, Wolfspeed Inc — which makes silicon carbide materials as well as silicon carbide (SiC) and gallium nitride (GaN)...
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Welsh Government to expand Newport’s compound semiconductor cluster
News: Suppliers 29 March 2023 Following a trade mission to California’s Silicon Valley last week, the Welsh Government’s Economy Minister Vaughan Gething says that it is progressing with plans to...
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How the BMW Group analyses semiconductor demand with AWS Glue
This is a guest post co-written by Maik Leuthold and Nick Harmening from BMW Group. The BMW Group is headquartered in Munich, Germany, where the company oversees 149,000 employees and manufactures cars...
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InnoPhase IoT Expands Use Cases For End-to-End IoT Video Camera Designs –...
Artificial intelligence (AI), solar panel augmentation, and a significantly shorter time to market are all features of new battery-operated video camera systems. A Talaria TWOTM Ultra-low power (ULP)...
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