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Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle
A new technical paper titled “Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology” was published by researchers at University of Ottawa, Sungkyunkwan University, and...
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Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of...
A technical paper titled “Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED” was published by researchers at Tohoku University in...
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ProTek Devices Intros High Voltage Suppression Component for Aerospace…
ProTek Devices’ SM100KWE78CA, a high-powered surface mount transient voltage suppression component It permits a bidirectional configuration and easy mounting to a printed circuit board. The minimum...
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Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven...
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Power Semiconductor Maker E-tronic Secures Series A+ Financing
E-tronic, a provider of power semiconductors and system solutions for electric vehicles, has recently announced the completion of its series A+ financing round raising tens of millions of yuan. The...
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ams OSRAM adds OSLON UV 3535 series to mid-power UV-C LED range
News: LEDs 22 March 2023 ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has introduced the OSLON UV 3535 series of mid-power UV-C LEDs, meeting customers’ requirements for longer lifetime,...
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ROHM’s ultra-high-speed control IC technology maximizes performance of GaN...
News: Microelectronics 23 March 2023 Due to their superior high-speed switching characteristics the adoption of GaN devices has expanded in recent years. However, the speed of control ICs (for...
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Siemens Keynote Stresses Global Priorities
Dirk Didascalou, Siemens CTO, gave a keynote at DVCon, raising our perspective on why we do what we do. Yes, our work in semiconductor design enables the cloud and 5G and smart everything, but these...
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Power Delivery Network Analysis in DRAM Design
My IC design career started out with DRAM design back in 1978, so I’ve kept an eye on the developments in this area of memory design to note the design challenges, process updates and innovations along...
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Chip Industry’s Technical Paper Roundup: Mar. 28
Industry Research GAAFETs; thermal simulation in 3DIC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs;...
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Research Bits: March 28
Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and...
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Speculation for Simulation. Innovation in Verification
This is an interesting idea, using hardware-supported speculative parallelism to accelerate simulation, with a twist requiring custom hardware. Paul Cunningham (Senior VP/GM, Verification at Cadence),...
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The Rise of the Chiplet
The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a...
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Enable predictive maintenance for line of business users with Amazon Lookout...
Predictive maintenance is a data-driven maintenance strategy for monitoring industrial assets in order to detect anomalies in equipment operations and health that could lead to equipment failures....
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Squeezing The Margins
Systems & Design OPINION Monitoring systems and quickly adjusting clock frequencies improves performance for specific applications and operating environments. Back in 2016, we looked at the...
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Options Widen For Optimizing IoT Designs
Creating a successful IoT design requires a deep understanding of the use cases, and a long list of tradeoffs among various components and technologies to provide the best solution at the right price...
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Wolfspeed’s Durham HQ hosts first stop on Biden’s ‘Invest in America’ tour
News: Microelectronics 29 March 2023 At its headquarters in Durham, NC, USA, Wolfspeed Inc — which makes silicon carbide materials as well as silicon carbide (SiC) and gallium nitride (GaN)...
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Welsh Government to expand Newport’s compound semiconductor cluster
News: Suppliers 29 March 2023 Following a trade mission to California’s Silicon Valley last week, the Welsh Government’s Economy Minister Vaughan Gething says that it is progressing with plans to...
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How the BMW Group analyses semiconductor demand with AWS Glue
This is a guest post co-written by Maik Leuthold and Nick Harmening from BMW Group. The BMW Group is headquartered in Munich, Germany, where the company oversees 149,000 employees and manufactures cars...
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InnoPhase IoT Expands Use Cases For End-to-End IoT Video Camera Designs –...
Artificial intelligence (AI), solar panel augmentation, and a significantly shorter time to market are all features of new battery-operated video camera systems. A Talaria TWOTM Ultra-low power (ULP)...
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